发明名称 PROCESS FOR FABRICATING CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a process for fabricating a ceramic electronic component in which delamination and cracking can be reduced by enhancing thickness precision. SOLUTION: An electrode pattern 70 and an auxiliary layer 60 by ceramic paint are printed on one surface of a ceramic paint layer 51. The electrode pattern 70 includes a plurality of electrodes 71 arranged in a predetermined pattern. The auxiliary layer 60 is a negative pattern of the electrode pattern 70 and has a gap g1 around the electrode 71. The electrode 71 and the auxiliary layer 60 have different heights T1 and T2. Following to the print process, at least one of the electrode 71 and the auxiliary layer 60 is collapsed, thus matching the height of the electrode 71 to that of the auxiliary layer 60. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278555(A) 申请公布日期 2006.10.12
申请号 JP20050093029 申请日期 2005.03.28
申请人 TDK CORP 发明人 SOTOMI TORU
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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