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发明名称
Vorrichtung zur Elektroplattierung
摘要
申请公布号
DE05075546(T1)
申请公布日期
2006.10.12
申请号
DE20050075546T
申请日期
1998.05.20
申请人
PROCESS AUTOMATION INTERNATIONAL LTD.;SHIPLEY CO.
发明人
HENINGTON, PAUL;LI, KWOK WAH;NG, KWOK WING;LEE, CHI CHUNG;HUANG, PIN CHUN;LEE, FANG HAO;MARSH, MARLIN VANCE;COLANGELO, CARL JOHN
分类号
C25D17/28;B65G49/04;C25D17/00;H05K3/24
主分类号
C25D17/28
代理机构
代理人
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