| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem of a large number of components mounted on a substrate in a matching circuit 4 for connecting a bandpass filter 1 and a transmission power amplifier 5 having a chip inductor and a chip capacitor, producing increased material cost and labor as a whole module, and a large volume as well. <P>SOLUTION: A DC block capacitor 6 is embedded in the transmission power amplifier 5. Also, the matching circuit 4 is configured of either one or both of a series inductor 2 formed of the conductor pattern of the surface layer or the internal layer of a dielectric layer and a parallel capacitor 3 formed of the conductor pattern of the surface layer or the internal layer of the dielectric layer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
