| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor capable of providing a sufficient strength to a dielectric substrate, resulting in suppressing the occurrence of cracks while oxidation of ends of internal electrode layers using a base metal is suppressed and excellent IR temperature dependence is maintained. SOLUTION: The method of manufacturing the multilayer ceramic electronic component including a dielectric layer whose interlayer thickness is 5μm or below and the internal electrode layer including the base metal includes a step of baking a laminate, wherein a dielectric layer paste and an internal electrode layer paste including the base metal are alternately arranged by 100 layers or over under a reduction environment; a first anneal step of applying anneal processing to the laminate after the baking under an exposure of a dew-point C1 at a temperature T1; and a second anneal step of applying anneal processing to the laminate after the first annealing, under an environment of a dew-point C2 of less than (C1-12)°C and less than 5°C at a temperature T2 equal to or more than the temperature T1. COPYRIGHT: (C)2007,JPO&INPIT
|
