发明名称 ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etching method by which a tunnel junction film 10a can be etched into a predetermined shape. SOLUTION: Plasma is generated by introducing a mixed gas of a halogen gas and an oxygen gas. Then, with an etched object heated to not less than 100°C nor more than 400°C, the tunnel junction film 10a is etched using the mask 90 formed of TiN, Ti, Ta, Zr, or Hf to form a tunnel junction element 10 having a predetermined shape. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278457(A) 申请公布日期 2006.10.12
申请号 JP20050091831 申请日期 2005.03.28
申请人 ULVAC JAPAN LTD 发明人 YAMAMOTO NAOSHI;KOKAZE YUTAKA;MATSUURA MASAMICHI
分类号 H01L21/3065;H01L21/8246;H01L27/105;H01L43/08;H01L43/12 主分类号 H01L21/3065
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