发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve a breakdown voltage between a contact formed in a self-alignment process and a gate electrode. SOLUTION: A recess 11a is formed in a side of laminated pattern B in which a gate structure A including at least a gate (polysilicon 8a) for controlling, a metal electrode 9a, and a hard mask 10a on a silicon substrate 1; and a side wall 13 is formed in the side of laminated pattern B so that it may be embedded. This can make the breakdown voltage between a contact 19 and the gate structure A improve since a spacing between the contact 19 and the metal electrode 9a becomes large compared with the case having no recess 11a. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278935(A) 申请公布日期 2006.10.12
申请号 JP20050098978 申请日期 2005.03.30
申请人 RENESAS TECHNOLOGY CORP 发明人 TSUNOMURA TAKAAKI;SUMINO JUN
分类号 H01L29/78;H01L21/336;H01L21/768;H01L21/8247;H01L27/115;H01L29/41;H01L29/423;H01L29/49;H01L29/788;H01L29/792 主分类号 H01L29/78
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