发明名称 RESIN-IMPREGNATED BASE MATERIAL FOR CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a resin-impregnated base material for a circuit board which base material can be produced constantly, and can be used in response to a high-density circuit board. SOLUTION: The resin-impregnated base material for the circuit board is made by impregnating a nonwoven fabric formed on a carrier sheet made of aromatic group liquid crystal polyester fibers with a matrix resin made of an aromatic group liquid crystal polyester, and drying the nonwoven fabric. It is desirable that the carrier sheet be a metal foil for a circuit board, that the weight per square meter of the nonwoven fabric made of the aromatic group liquid crystal polyester fibers be 6 to 10 g/m<SP>2</SP>, and that the melting point of aromatic group liquid crystal polyester fibers be 290°C or lower. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278647(A) 申请公布日期 2006.10.12
申请号 JP20050094563 申请日期 2005.03.29
申请人 MITSUBISHI PAPER MILLS LTD;SUMITOMO CHEMICAL CO LTD 发明人 KITO MASATOSHI;AIZAWA WAKANA;OKAMOTO SATOSHI
分类号 H05K1/03;B32B5/28;C08J5/06;C08L67/00 主分类号 H05K1/03
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