| 摘要 |
A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a plurality of copper vias. Each copper via is in physical contact with the ceramic layer. A plurality of pads are formed on the polyimide layer. Each of the plurality of pads is in physical contact with a copper via of the plurality of copper vias. In this way, the pads are supported by a continuous copper arrangement, thereby providing greater support for the probe pads than if the probe pads were supported by the polyimide layer, as the mechanical strength of polyimide layer is lower than the mechanical strength of copper. |
