| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive pattern forming device utilizing electrostatic force capable of simplifying processes, reducing costs, manufacture time and environmental loads, improving productivity, coping with a large area, and changing a pattern without limiting a substrate or being accompanied by the increase of new processes of plating or the like. SOLUTION: The conductive pattern forming device is provided with an electrostatic latent image forming means for forming an electrostatic pattern 5 on the surface of a dielectric thin film body 4; and a developing means 6 for supplying a conductive particle dispersed solution 7 to the electrostatic latent image, bringing it into contact and developing and forming a conductive pattern 14. For the conductive particle dispersed solution, conductive particles for which ionic organic molecules are absorbed and whose particle size is≤100 nm are dispersed in a nonpolar solvent. COPYRIGHT: (C)2007,JPO&INPIT
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