| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the major practical problem wherein sufficient strength has not been obtained in a semiconductor device of a chip size package, because the package is bonded on an insulating film 74 and has a uniform thickness, while a semiconductor substrate 60 must be supported and fixed on the same plane, by a resin layer 78 due to a structure in which the semiconductor substrates 60 are divided, using a slit hole 80. <P>SOLUTION: Via holes 35, for forming piercing electrodes 27, 28 to be provided on second regions 13, 14 and a dividing groove 30 for dividing a first region 12 from the second regions 13, 14, are formed simultaneously to omit alignment of both. As a result of this, the dividing groove is formed on a level difference having strong adhesiveness and strength of a resin layer, and the first region, and the second region can be supported and fixed on the same plane. <P>COPYRIGHT: (C)2007,JPO&INPIT |
