| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe device capable of performing precise contact with electrodes under test of a narrow pitch such as a chip size package and securely establishing conduction. SOLUTION: The probe device 1 is provided with a flexible film substrate 3 consisting of an insulating material, contact terminals 4 consisting of a plurality of conductive patterns formed in parallel on the film substrate 3, an elastically deformable reinforcement plate 5 stuck on the rear side of the film substrate 3, and a substrate holding mechanism 6 holding the film substrate 3, the contact terminals 4, and the reinforcement plate 5 in the curved state and bringing the tips of the contact terminals 4 into press contact with the electrodes under test. The tips 13 of the contact terminals 4 coincide with one end of the film substrate 3 and are arranged so as to agree with the pitch of the electrodes under test. COPYRIGHT: (C)2007,JPO&INPIT
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