| 摘要 |
PROBLEM TO BE SOLVED: To provide a brazing filler metal sheet which solves problems of degraded strength and lowered drop/impact resistance arising from formation of air gaps, and which contains no Pb and used for joining a semiconductor element for a power device system with large heat generation to a wiring board. SOLUTION: The brazing filler metal sheet comprises an Sn layer on the surface of an Ag or a Cu foil. The average thickness of the Ag or Cu foil is, desirably, 20-200 μm and, more desirably, the average thickness of the Sn layer is 10-30 μm. COPYRIGHT: (C)2007,JPO&INPIT
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