发明名称 |
Alloy material for semiconductors, semiconductor chip using the alloy material and production method of the same |
摘要 |
According to the present invention, there is provided an alloy material for semiconductors containing of Au as a main component and Ag in the range of not less than 3 wt % to not more than 40 wt %.
|
申请公布号 |
US2006226546(A1) |
申请公布日期 |
2006.10.12 |
申请号 |
US20050536406 |
申请日期 |
2005.12.05 |
申请人 |
INOUE KAZUNORI;ISHIKURA CHIHARU |
发明人 |
INOUE KAZUNORI;ISHIKURA CHIHARU |
分类号 |
H01L21/28;H01L29/40;C22C5/02;H01L21/285;H01L21/44 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|