发明名称 Alloy material for semiconductors, semiconductor chip using the alloy material and production method of the same
摘要 According to the present invention, there is provided an alloy material for semiconductors containing of Au as a main component and Ag in the range of not less than 3 wt % to not more than 40 wt %.
申请公布号 US2006226546(A1) 申请公布日期 2006.10.12
申请号 US20050536406 申请日期 2005.12.05
申请人 INOUE KAZUNORI;ISHIKURA CHIHARU 发明人 INOUE KAZUNORI;ISHIKURA CHIHARU
分类号 H01L21/28;H01L29/40;C22C5/02;H01L21/285;H01L21/44 主分类号 H01L21/28
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