发明名称 Semiconductor integrated circuit and wafer having diffusion regions differing in thickness and method for manufacturing the same
摘要 A semiconductor integrated circuit includes a rectangular low speed circuit area including a low speed circuit comprising a low speed transistor having a first source extension region and a first drain extension region, and a rectangular high speed circuit area adjacent to the low speed circuit area and including a high speed circuit comprising a high speed transistor having a second source extension region and a second drain extension region thinner than the first source and drain extension regions.
申请公布号 US2006226447(A1) 申请公布日期 2006.10.12
申请号 US20050220716 申请日期 2005.09.08
申请人 发明人 IINUMA TOSHIHIKO
分类号 H01L27/10;H01L21/336 主分类号 H01L27/10
代理机构 代理人
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