| 摘要 |
PROBLEM TO BE SOLVED: To provide a detection method and a detector for highly accurately inspecting the presence or the absence of cracks of a silicon wafer in a short period of time without damaging the silicon wafer. SOLUTION: In the crack detection method and its detector for the silicon wafer 10, the silicon wafer 10 is oscillated by bringing an oscillating body 11 into contact with the silicon wafer 10, and a transfer function is calculated from frequency characteristics of the oscillating body 11 and those of the silicon wafer 10 and it is compared with the previously calculated transfer function. COPYRIGHT: (C)2007,JPO&INPIT
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