发明名称 |
Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same |
摘要 |
A layered wiring line of silver or silver alloy includes a silver or silver alloy conductor layer (32) including silver or silver alloy; and a protective conductor layer (31) layered on and covering the silver or silver alloy conductor layer. A method for forming the layered wiring line includes steps of: layering the silver or silver alloy conductor layer and the protective conductor layer on a substrate in turn; making the protective conductor layer in contact with a liquid etchant common to the silver or silver alloy conductor layer and the protective conductor layer by a predetermined pattern. The protective conductor layer has a thickness satisfying a relationship in that a ratio of (the protective conductor layer's thickness) / (the silver or silver alloy conductor layer's thickness) is less than that of (a solution velocity of the protective conductor layer in the liquid etchant) / (a solution velocity of the silver or silver alloy conductor layer in the liquid etchant). |
申请公布号 |
EP1280213(A3) |
申请公布日期 |
2006.10.11 |
申请号 |
EP20020016496 |
申请日期 |
2002.07.23 |
申请人 |
PIONEER CORPORATION |
发明人 |
NAGAYAMA, KENICHI;SUGIMOTO, AKIRA;MIYAGUCHI, SATOSHI |
分类号 |
H05B33/10;G09F9/00;G09F9/30;H01B1/02;H01B5/14;H01B13/00;H01L21/3205;H01L23/52;H01L27/32;H01L51/50;H01L51/52;H04N5/70;H05B33/22;H05B33/26;H05K1/09;H05K3/06 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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