发明名称 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same
摘要 A layered wiring line of silver or silver alloy includes a silver or silver alloy conductor layer (32) including silver or silver alloy; and a protective conductor layer (31) layered on and covering the silver or silver alloy conductor layer. A method for forming the layered wiring line includes steps of: layering the silver or silver alloy conductor layer and the protective conductor layer on a substrate in turn; making the protective conductor layer in contact with a liquid etchant common to the silver or silver alloy conductor layer and the protective conductor layer by a predetermined pattern. The protective conductor layer has a thickness satisfying a relationship in that a ratio of (the protective conductor layer's thickness) / (the silver or silver alloy conductor layer's thickness) is less than that of (a solution velocity of the protective conductor layer in the liquid etchant) / (a solution velocity of the silver or silver alloy conductor layer in the liquid etchant).
申请公布号 EP1280213(A3) 申请公布日期 2006.10.11
申请号 EP20020016496 申请日期 2002.07.23
申请人 PIONEER CORPORATION 发明人 NAGAYAMA, KENICHI;SUGIMOTO, AKIRA;MIYAGUCHI, SATOSHI
分类号 H05B33/10;G09F9/00;G09F9/30;H01B1/02;H01B5/14;H01B13/00;H01L21/3205;H01L23/52;H01L27/32;H01L51/50;H01L51/52;H04N5/70;H05B33/22;H05B33/26;H05K1/09;H05K3/06 主分类号 H05B33/10
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