Electrically conducting bonding connection

摘要

An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate ( 1 ) and the support plate ( 1 ) by providing a hole ( 4, 5 ), into which an electrically conducting bonding element ( 2 ) with a bondable surface ( 3 ) is pressed in such a way that the support plate ( 1 ) and the bonding element ( 2 ) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element ( 2 ).