发明名称 |
3-D stackable semiconductor package |
摘要 |
A 3-D stackable semiconductor package includes a first component and a second component. The semiconductor package is formed by stacking the back of the first component and the back of the second component together. The metal pads on the surfaces of the first component and the second component are redistributed to the edge of the first and the second components by a redistribution layer. A plurality of electric conduction posts is formed at the edge of the first and the second component to transmit electric signals between them. The semiconductor package transmits electric signals to the PCB by the electric conductive bumps.
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申请公布号 |
US7119429(B2) |
申请公布日期 |
2006.10.10 |
申请号 |
US20050074732 |
申请日期 |
2005.03.09 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHANG SHU-MING;HO TZONG-CHE |
分类号 |
H01L23/02;H01L23/48;H01L25/10 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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