| 摘要 |
A jig apparatus for arraying and supporting work to be soldered wherein a plurality of lower supporting bars for supporting the lower side of a work are arranged so as to extend in a frame designed to be mounted on a conveyor holder of an automatic soldering line, upper supporting bars are arranged so as to extend above and in parallel with the lower supporting bars to press the work from the upper side thereof. The upper supporting bars have one end fitted to the frame. A gate member supports the other end of the upper supporting bars and movable up and down with respect to the frame. Work insertion openings are formed in the frame such as to oppose the gate member. The lower supporting bars are made of elongated channel members with a substantially U-shaped cross-section, each of the elongated channel members having holes formed in the floor thereof. |
