| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable wiring board which is constituted of a low temperature baked substrate made of glass containing BaO having an improved anti-chemical property and a metallized interconnection layer having an improved adhesion strength and which has a large coefficient of thermal expansion and can be stably and firmly kept connected over a long period of time to an outside circuit board containing organic resin and to provide a reliable package for storing a semiconductor element. SOLUTION: In a wiring board for a package, etc., which has a metallized interconnection layer disposed on the surface of or inside an insulating substrate 1, the insulating substrate 1 is made of sintered material. The sintered material of which the insulating substrate 1 is made of is mainly made of glass including 5-60 wt.% of BaO and a filter including a metal oxide which has a coefficient of thermal expansion of 6 ppm/ deg.C or above at 40-400 deg.C and includes 0.1-30 wt.%, converted in terms of ZrO2, of a Zr compound such as ZrO2 in the entire weight, A coefficient of thermal expansion of the sintered material is 8.5-18 ppm/ deg.C at 40-400 deg.C. |
