发明名称 Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P)
摘要 A Pb-free solder alloy based on Sn as matrix is provided, which is a metal that has no toxicity and is environmental friendly. The Pb-free solder comprises a tetra-nary composition consisting essentially of about 99.0 weight % Sn, 0.3 to 0.4 weight % Ag, and 0.6 to 0.7 weight % Cu, with off-eutectic melting temperature of 217 to 227 degree Celsius. The fourth component is a non-metallic phosphorus (P), and 0.01 to 1.0 weight % of phosphorus is added into said composition to improve better micro-structural stability and hence reduce the formation of dross when hand soldering, wave soldering and reflow soldering during the electronic assembly installation process.
申请公布号 EP1707302(A2) 申请公布日期 2006.10.04
申请号 EP20060003796 申请日期 2006.02.24
申请人 AOKI LABORATORIES LTD. 发明人 LEUNG, WAI YIN DAVID
分类号 B23K35/26;C22C13/00 主分类号 B23K35/26
代理机构 代理人
主权项
地址