发明名称 Integrated circuit and fabrication process
摘要 An integrated circuit has at least one semiconductor device for storing charge that includes at least one elementary active component and at least one elementary storage capacitor. The device includes a substrate having a lower region containing at least one buried capacitive elementary trench forming the elementary storage capacitor, and an elementary well located above the lower region of the substrate and isolated laterally by a lateral electrical isolation region. The elementary active component is located in the elementary well or in and on the elementary well. The capacitive elementary trench is located under the elementary active component and is in electrical contact with the elementary well. In one preferred embodiment, the lateral electrical isolation region is formed by a trench filled with a dielectric material and has a greater depth than that of the elementary well. Also provided is a method for fabricating an integrated circuit that includes a semiconductor device for storing charge.
申请公布号 US7115933(B2) 申请公布日期 2006.10.03
申请号 US20030466145 申请日期 2003.12.26
申请人 STMICROELECTRONICS S.A. 发明人 MENUT OLIVIER;GRIS YVON
分类号 H01L27/108;H01L21/8242;H01L27/10;H01L29/68 主分类号 H01L27/108
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