| 摘要 |
Method of manufacturing a chip card having an antenna support, two card bodies and an electronic module or a chip linked to the antenna. This method has a first lamination step which includes fusing two thermoplastic sheets ( 32, 34 or 62, 64 ) on each side of antenna support ( 10 or 40 ) at a temperature sufficient for the thermoplastic sheet material to soften and to flow wholly so as to eliminate any differences in thickness from the support, and a second lamination step carried out after a period of time necessary for the thermoplastic sheets ( 32, 34 or 62, 64 ) to be solidified, the second step including fusing by hot pressing two plastic layers ( 36, 38 or 66, 68 ) making up the card bodies onto the plasticised and even faces of uniformly thick antenna support ( 30 or 60 ) plasticised by the thermoplastic sheets.
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