| 发明名称 |
METHOD FOR PRODUCING TIN-SILVER ALLOY PLATING FILM, THE TIN-SILVER ALLOY PLATING FILM AND LEAD FRAME FOR ELECTRONIC PARTS HAVING THE FILM |
| 摘要 |
THE PRESENT INVENTION RELATES TO A METHOD F OR PRODUCING A TIN-SILVER ALLOY PLATING FILM (8) HAVING AN EXCELLENT WETTABILITY AND IMPROVED IN SOLCIERABILITY AND SAID METHOD COMPRISES A STEP OF HEAT TREATING THE SURFACE OF THE TIN-SILVER ALLOY PLATING FILM (8) PREFERABLY THE HEAT TREATING TEMPERATURE IS 70-210°C. |
| 申请公布号 |
MY126125(A) |
申请公布日期 |
2006.09.29 |
| 申请号 |
MY2001PI05263 |
申请日期 |
2001.11.16 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HISAHIRO TANAKA;MATSUO MASUDA;TSUYOSHI TOKIWA |
| 分类号 |
B23K1/20;C25D7/12;C25D3/60;C25D5/48;C25D5/50;H01L23/495;H01L23/50 |
主分类号 |
B23K1/20 |
| 代理机构 |
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