发明名称 MULTI-CHIP MODULE DEVICE AND MULTI-CHIP SHUTDOWN CONTROL METHOD
摘要 PROBLEM TO BE SOLVED: To execute shutdown control corresponding to a priority order in simple configuration using existent semiconductor chip 4 for voltage adjustment and semiconductor chip 5 for amplifier. SOLUTION: When the semiconductor chip 4 for voltage adjustment is affected by heating in the semiconductor chip 5 for amplifier, a calorific value can be reduced by controlling the operating state of the semiconductor chip 5 for amplifier from a microcomputer 10 present outside a substrate 11 based on a caution signal S1 received from the semiconductor chip 4 for voltage adjustment, so that shutdown control corresponding to a priority order can be executed in simple configuration just connecting the existent semiconductor chip 4 for voltage adjustment and semiconductor chip 5 for amplifier to the external microcomputer 10. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006261581(A) 申请公布日期 2006.09.28
申请号 JP20050080223 申请日期 2005.03.18
申请人 SONY CORP 发明人 NISHINO YASUSHI
分类号 H01L23/58;G05F1/56;H02M1/00 主分类号 H01L23/58
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