发明名称 METHOD FOR PRODUCING CIRCUIT BOARD WITH Ag-Pd ALLOY NANOPARTICLES
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for producing a wiring board having excellent conductivity and improved migration resistance. <P>SOLUTION: A conductive ink containing Ag-Pd alloy, wherein the content of Pd is 5 to 40 wt%. The conductive ink is printed by an ink jet printing method to form a circuit pattern, thus producing a wiring board. The method for producing the wiring board comprises a step for producing the conductive ink in which the Ag-Pd alloy nanoparticles are dispersed in an organic solvent, and a step for jetting the conductive ink on a board by an ink jet printing method and then calcining the printed board. Thereby, the wiring board having excellent price competitive ability, excellent conductivity and improved migration resistance can be produced. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006257403(A) 申请公布日期 2006.09.28
申请号 JP20060031730 申请日期 2006.02.08
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHO HYE-JIN;JUN BYUNG-HO
分类号 B22F9/24;C09D11/00;C09D11/322;C09D11/52;C22C5/06;H01B1/22;H01B5/14;H01B13/00;H05K1/09;H05K3/10 主分类号 B22F9/24
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