| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment apparatus which can uniformly process the surface of an area in a material to be processed without leaking a processing gas when the material is subject to partly surface processing. SOLUTION: The processing area F1 of a work W is arranged opposite to the processing surface 43 of a processing head 1 for jetting a processing gas, and the processing gas is fed between the processing surface 43 and the processing area F1 to process the surface of the work W. In the apparatus M having such a mechanism, the processing head 1 is provided with an exhaust port 41a adjacent to the processing surface 43 in order to discharge the processing gas, and the processing surface 43 is projecting toward the work W from the surface of the processing head 1 facing the work W. COPYRIGHT: (C)2006,JPO&NCIPI
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