发明名称 PROCESS FOR PREPARING A NON-CONDUCTIVE SUBSTRATE FOR ELECTROPLATING
摘要 A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.
申请公布号 WO2006043994(A3) 申请公布日期 2006.09.28
申请号 WO2005US20635 申请日期 2005.06.10
申请人 MACDERMID, INCORPORATED 发明人 RETALLICK, RICHARD, C.;LEE, HYUNJUNG
分类号 C25D5/34;C25D3/38 主分类号 C25D5/34
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