发明名称 |
PROCESS FOR PREPARING A NON-CONDUCTIVE SUBSTRATE FOR ELECTROPLATING |
摘要 |
A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating. |
申请公布号 |
WO2006043994(A3) |
申请公布日期 |
2006.09.28 |
申请号 |
WO2005US20635 |
申请日期 |
2005.06.10 |
申请人 |
MACDERMID, INCORPORATED |
发明人 |
RETALLICK, RICHARD, C.;LEE, HYUNJUNG |
分类号 |
C25D5/34;C25D3/38 |
主分类号 |
C25D5/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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