Heat sink for microprocessor, has base body at which lamellas are attached, and heat exchanger made of porous material, and including hollow space, where lamellas are inserted in exchanger so that gap exists between base body and exchanger

摘要

The sink has a base body at which lamellas are attached, and a heat exchanger made of porous material. The heat exchanger has a hollow space and the lamellas are inserted in the heat exchanger such that a gap exists between the base body and the heat exchanger, where the base body is formed in a rotational symmetrical manner. The heat exchanger is connected with the lamellas. The lamellas are angularly arranged at the base body. Independent claims are also included for the following: (1) a cooling arrangement with a heat sink (2) an application of a cooling body in an electrical device.