发明名称 PATTERN FORMING MATERIAL, PATTERN FORMING APPARATUS, AND PATTERN FORMING METHOD
摘要 <p>This invention provides a pattern forming material, which, even in a highly sensitive photosensitive layer, can simultaneously realize excellent developing properties and tackiness, can suppress distortion of an image formed on the photosensitive layer and thus can form a pattern suitable, for example, for the production of printed wiring boards including package boards and a high-definition permanent pattern in a semiconductor field with high definition and good efficiency, a pattern forming method and a pattern. The pattern forming material comprises at least a photosensitive layer formed using a photosensitive composition. The photosensitive composition comprises at least one epoxy acrylate compound, a binder comprising at least one vinyl copolymer having on its side chain an acryloyl group and an acid group, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. When the photosensitive layer is exposed and developed, the minimum energy of light used in the exposure, which does not cause a difference in the thickness of the photosensitive layer in its part to be exposed between before the exposure and after the exposure and after the development, is 0.1 to 80 mJ/cm&lt;SUP&gt;2&lt;/SUP&gt;.</p>
申请公布号 WO2006100817(A1) 申请公布日期 2006.09.28
申请号 WO2006JP300210 申请日期 2006.01.11
申请人 FUJI PHOTO FILM CO., LTD.;WAKATA, YUICHI;HAYASHI, TOSHIAKI;TAKAYANAGI, TAKASHI 发明人 WAKATA, YUICHI;HAYASHI, TOSHIAKI;TAKAYANAGI, TAKASHI
分类号 G03F7/004;G03F7/027;G03F7/038;G03F7/20;H01L21/027;H05K3/00 主分类号 G03F7/004
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