| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bond via pattern of bond pad structure capable of improving reliability, bonding performance, and the results of quality control. <P>SOLUTION: The top via pattern 22 of bond pad structure has at least one first via group 18 and at least one second via group 20 that are mutually adjacent. The first via group 18 has at least two first line vias 18a, 18b, 18c that are extended in a first direction. The second via group 20 has at least second line vias 20a, 20b, 20c that are extended in a second direction different from the first direction. The line vias 18a, 18b, 18c of the first via group 18 do not intersect with the line vias 20a, 20b, 20c of the second via group 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
