| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for reducing the thickness of a semiconductor package in which a sensor chip is accomodated, and to reduce the distortion of the bottom plate of a case body of the semiconductor package at the same time. SOLUTION: The semiconductor package 1 is provided with the bottom plate 3, side walls 4 which are formed on the peripheral border of the bottom plate 3, and the sensor chip 5 which is accomodated in a chip accommodation space 6 surrounded by the side walls 4. In this case, a chip placing hollow 7 for placing the sensor chip 5 is provided in the bottom plate 3. COPYRIGHT: (C)2006,JPO&NCIPI
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