发明名称 Method for preparing a polishing slurry having high dispersion stability
摘要 The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the resulting dispersion an alkaline material in an amount of 0.1 to 8 weight parts based on 100 weight parts of the polishing particles. The polishing slurry obtained by the inventive method exhibits good dispersion stability and non-Prestonian polishing performance, which can be beneficially employed in chemical mechanical polishing of various precision electronic devices.
申请公布号 US2006213126(A1) 申请公布日期 2006.09.28
申请号 US20060389396 申请日期 2006.03.24
申请人 CHO YUN J;LEE IN Y;JEON HOON S;HONG DUK Y;KIM TAIYOUNG;LEE SANGICK;PARK EUNKYOUNG 发明人 CHO YUN J.;LEE IN Y.;JEON HOON S.;HONG DUK Y.;KIM TAIYOUNG;LEE SANGICK;PARK EUNKYOUNG
分类号 C09K3/14;B24B37/00;H01L21/304 主分类号 C09K3/14
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