发明名称 |
Method for preparing a polishing slurry having high dispersion stability |
摘要 |
The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the resulting dispersion an alkaline material in an amount of 0.1 to 8 weight parts based on 100 weight parts of the polishing particles. The polishing slurry obtained by the inventive method exhibits good dispersion stability and non-Prestonian polishing performance, which can be beneficially employed in chemical mechanical polishing of various precision electronic devices.
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申请公布号 |
US2006213126(A1) |
申请公布日期 |
2006.09.28 |
申请号 |
US20060389396 |
申请日期 |
2006.03.24 |
申请人 |
CHO YUN J;LEE IN Y;JEON HOON S;HONG DUK Y;KIM TAIYOUNG;LEE SANGICK;PARK EUNKYOUNG |
发明人 |
CHO YUN J.;LEE IN Y.;JEON HOON S.;HONG DUK Y.;KIM TAIYOUNG;LEE SANGICK;PARK EUNKYOUNG |
分类号 |
C09K3/14;B24B37/00;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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