| 摘要 |
A direct backlight module at least includes a light-source, a substrate, a heat source and-a heat-pipe, wherein the heat source comprises a PCB, an inventer, and a power supply. The light-source is disposed on the substrate. A bottom surface of the substrate is divided into a first predetermined portion and a second predetermined portion. The PCB is disposed in the first predetermined portion. The light-source is electrically connected with the PCB. The heat-pipe is disposed on the bottom surface of the substrate to transfer heat from the first predetermined portion to the second predetermined portion, such that the temperature distribution of the direct backlight module can be more evenly.
|
