METHOD OF SEPARATING LAYERS OF MATERIAL USING A LASER BEAM
摘要
A lift off process is used to separate a layer of material from a substrate (110) by irradiating an interface between the layer of material and the substrate (110). According to one exemplary process, the layer is separated into a plurality of sections (112) corresponding to dies on the substrate (110) and a homogeneous beam spot is shaped to cover an integer number of the sections (112).
申请公布号
WO2005094320(A3)
申请公布日期
2006.09.28
申请号
WO2005US10412
申请日期
2005.03.29
申请人
J.P. SERCEL ASSOCIATES INC.;PARK, JONGKOOK;SERCEL, JEFFREY, P.;SERCEL, PATRICK, J.
发明人
PARK, JONGKOOK;SERCEL, JEFFREY, P.;SERCEL, PATRICK, J.
