| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity without increasing kinds of holders of a holding tool for taking a chip around in a bump forming device. <P>SOLUTION: The bump forming device 10 has a tray loader 12, and a supply and storage tray 14. Also, the bump forming device 10 comprises a bump formation section 20 having two bonding stages 24, 26 for forming bumps; a leveler 40 including a leveler stage 44 having two holding stages for aligning bump heights; and a chip collet conveyance part 60 for holding the chip for taking around it among a supply/storage tray 14, two bonding stages 24, 26 at the bump formation section 20, two holding stages at the leveler section 40, and the supply/storage tray 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
