| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated film suitably used as an insulating layer in an electronic mounting use or an adhesive film for fixing a semiconductor wafer or a die attach film for use in a semiconductor device, and a laminate using it. SOLUTION: The laminated film is composed of a base material (A) comprising a full aromatic polyimide film and the resin layer (B) formed on one side or both sides of the base material and characterized in that the coefficient of in-plane linear expansion at a temperature of 100-200°C thereof is -3 to 6 ppm/°C and the elastic modulus thereof is 2-13 GPa. COPYRIGHT: (C)2006,JPO&NCIPI
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