| 摘要 |
PROBLEM TO BE SOLVED: To provide an RF impedance measuring device capable of accurately measuring RF impedance (S parameter) especially of a power source/GND system line of a package substrate to a high frequency region. SOLUTION: An RF probe 210 is directly brought into contact with terminals 201 formed on the front and back surfaces of the package substrate 200, thereby measuring the RF impedance (S parameter) between the terminals. The RF probe 210 is directly brought into contact with a substrate 240 for phase calibration arranged horizontally and perpendicularly to the installed package substrate 200 by a rotating mechanism 220 connected to the RF probe 210. The phase difference between the terminals of the package substrate 200 is measured, and the measured value of the RF impedance (S parameter) is calibrated with this phase difference. COPYRIGHT: (C)2006,JPO&NCIPI
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