| 摘要 |
Applicant discloses a method for fabricating a magnetic write head with a coil with a high aspect ratio using a Chemical Vapor Deposition process such as Atomic Layer Deposition (ALD), High Speed ALD, Plasma Enhanced ALD (PEALD), Plasma Enhanced Chemical Vapor Deposition (PECVD) or Low Pressure Chemical Vapor Deposition (LPCVD) to form encapsulating films over the coils without voids. Materials which can be used for encapsulation include Al<SUB>2</SUB>O<SUB>3</SUB>, SiO<SUB>2</SUB>, AlN, Ta<SUB>2</SUB>O<SUB>5</SUB>, HfO<SUB>2</SUB>, ZrO<SUB>2</SUB>, and YtO<SUB>3</SUB>. The use of an ultra-conformal deposition process allows the pitch of the coils to be smaller than it is possible in the prior art. The method according to the invention also allows materials with a smaller coefficient of thermal expansion than hardbake photoresist to be used with resulting improvements in thermal protrusion characteristics.
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