| 摘要 |
A semiconductor component is disclosed. The semiconductor component includes a silicon cap (12) that is step-sawn with a dice saw (75) to include at least one horizontal step (HS) and at least one vertical step (VS) for shaping a structure on one or more sides of the silicon cap (12). A semiconductor device (10) is also disclosed. The semiconductor device (10) includes a silicon cap wafer (12a), a bonding media (14), a sensor wafer (16), and a bond pad (20) placed over the sensor wafer (16). The silicon cap wafer (12a) includes the at least one horizontal step (HS) and the at least one vertical step (VS) formed by the dice saw (75) to define a bond pad opening. A method (50) for shaping the semiconductor component with the at least one horizontal step (HS) and the at least one vertical step (VS) is also disclosed.
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