CIRCUIT BOARD ASSEMBLY AND METHOD OF ATTACHING A CHIP TO A CIRCUIT BOARD
摘要
An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.
申请公布号
EP1704618(A2)
申请公布日期
2006.09.27
申请号
EP20050711705
申请日期
2005.01.13
申请人
RAYTHEON COMPANY
发明人
HAUHE, MARK, S.;ROLSTON, KEVIN, C.;QUAN, CLIFTON;FENGER, HAROLD, S.;WONG, TSE, E.
