Cellular and Wi-Fi communication devices integrated with a thin-film passive-component filter on an insulating substrate

摘要

The specification describes an integrated passive device (IPD) designed to allow implementation of cellular RF and Wi-Fi RF in a single hand held device. To address the problem of RF interference a thin film RF high rejection bandpass filter (39) is formed in an IPD implementation by forming thin-film passive components, e.g. a thin-film capacitor and a thin-film inductor, on an insulating substrate. The IPD implementation preferably uses silicon as the substrate material. This allows the thin film RF high rejection bandpass filter to be made using silicon processing technology, and thus produce low cost filters that still meet stringent performance requirements demanded due to the co-existing RF units. In preferred embodiments of the invention, wafer level processing using silicon substrates adds to the cost effective manufacture of the highly functional IPDs.