发明名称 SOI substrate, element substrate, semiconductor device, electro-optical apparatus, electronic equipment, method of manufacturing the SOI substrate, method of manufacturing the element substrate, and method of manufacturing the electro-optical apparatus
摘要 An SOI (Silicon On Insulator) substrate is provided with: a support substrate ( 201 ); a single crystal silicon layer ( 202 ) disposed above one surface of the support substrate; an insulation portion ( 205 ) disposed between the support substrate and the single crystal silicon layer, the insulation portion comprising a single layer of an insulation film or a lamination structure of a plurality of insulation films, and including a silicon nitride film or a silicon nitride oxide film ( 204 ).
申请公布号 US7112514(B2) 申请公布日期 2006.09.26
申请号 US20030431390 申请日期 2003.05.08
申请人 SEIKO EPSON CORPORATION 发明人 YASUKAWA MASAHIRO
分类号 H01L21/30;H01L21/762;H01L21/77;H01L21/84;H01L27/12;H01L29/786 主分类号 H01L21/30
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