发明名称 Methods of fabricating a composite carbon nanotube thermal interface device
摘要 Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.
申请公布号 US7112472(B2) 申请公布日期 2006.09.26
申请号 US20030607525 申请日期 2003.06.25
申请人 INTEL CORPORATION 发明人 DUBIN VALERY M.
分类号 H01L21/50;B01J23/74;B01J37/02;B01J37/34;H01L21/48;H01L23/373;H01L23/433 主分类号 H01L21/50
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