发明名称 |
Methods of fabricating a composite carbon nanotube thermal interface device |
摘要 |
Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.
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申请公布号 |
US7112472(B2) |
申请公布日期 |
2006.09.26 |
申请号 |
US20030607525 |
申请日期 |
2003.06.25 |
申请人 |
INTEL CORPORATION |
发明人 |
DUBIN VALERY M. |
分类号 |
H01L21/50;B01J23/74;B01J37/02;B01J37/34;H01L21/48;H01L23/373;H01L23/433 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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