| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing multilayer substrate where electronic components are embedded within resin without filling a gap between electronic components and substrate with proper intermediate materials. SOLUTION: In the method, a prepleg and a thermosetting resin are used. The thermosetting resin remains in the plate condition under the first temperature range, in the thermofluid condition in the second temperature range, and in the cured condition in the third temperature range. The prepleg compresses a sheet under the temperature within the second temperature range. Moreover, in the method, the sheet 12 previously providing resin fluidity suppressing holes in a hole machining process 117 is laminated in the laminating process 116, and the resin fluidity suppressing holes are embedded by allowing the resin to flow in the compressing process 122. Accordingly, the gaps between the electronic components 105, 106 and substrate 101 are filled with resin without use of intermediate material to achieve the multilayer substrate embedding the electronic components 105 and 106. COPYRIGHT: (C)2006,JPO&NCIPI
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