| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic substrate which offers more multilayering or reduction in size and improvement on a degree of freedom in designing of a multilayer ceramic substrate, which increases a degree of freedom in designing and makes the substrate more compact by electrically connecting different dielectric materials in the direction of the principal plane of a sheet, and which can form the dielectric materials in a required size at a required place compared with the conventional multilayer structure while alleviating the restrictions on the physical properties (calcination shrinking percentage and coefficient of thermal expansion) of the dielectric materials to be combined. SOLUTION: A cutout or crack is formed in a predetermined part of a second green sheet. Then, with the predetermined part kept placed on a second support, other part than the predetermined part is peeled off with a tape. Then, a first green sheet having a punched hole is laid on top of the second support, and the predetermined part is fit into the punched hole to fabricate a composite green sheet composed of different materials. In fabricating the composite green sheet, the predetermined part of the second green sheet is always kept placed on the second support having no hole to prevent the dropout of the inserted green sheet. COPYRIGHT: (C)2006,JPO&NCIPI |
