| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an epoxy resin composition for sealing semiconductors which is excellent in both moldability and curability. <P>SOLUTION: The epoxy resin composition for sealing semiconductors, which contains components (A)-(D) mentioned below, is manufactured by dry blending a curing accelerator, namely component (C), in a powdered condition with other components and kneading the mixture. Herein, (A) is an epoxy resin, (B) is a curing agent, (C) is a curing accelerator represented by general formula (1) and (D) is an inorganic filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
