发明名称 |
Electronic component housing structural body |
摘要 |
An electronic component housing structural body includes a first housing body accommodating electronic components and a second housing body accommodating electronic components. Fitting plane of the first and second housing bodies include a liquid passage area and a communicating passage area. The liquid passage area includes a cooling passage in which cooling liquid flows. The communicating passage area includes a communicating passage that connects housing chambers of the first and second housing bodies. Furthermore, a single sealing member is disposed on the fitting plane to independently surround and seal the liquid passage area and the communicating passage area.
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申请公布号 |
US2006207780(A1) |
申请公布日期 |
2006.09.21 |
申请号 |
US20060371107 |
申请日期 |
2006.03.09 |
申请人 |
AISIN AW CO., LTD. |
发明人 |
SHINMURA OSAMU;UECHI TATSUYUKI |
分类号 |
H02G3/08;F16J15/10;H02M7/48;H05K7/20 |
主分类号 |
H02G3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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