发明名称 Electronic component housing structural body
摘要 An electronic component housing structural body includes a first housing body accommodating electronic components and a second housing body accommodating electronic components. Fitting plane of the first and second housing bodies include a liquid passage area and a communicating passage area. The liquid passage area includes a cooling passage in which cooling liquid flows. The communicating passage area includes a communicating passage that connects housing chambers of the first and second housing bodies. Furthermore, a single sealing member is disposed on the fitting plane to independently surround and seal the liquid passage area and the communicating passage area.
申请公布号 US2006207780(A1) 申请公布日期 2006.09.21
申请号 US20060371107 申请日期 2006.03.09
申请人 AISIN AW CO., LTD. 发明人 SHINMURA OSAMU;UECHI TATSUYUKI
分类号 H02G3/08;F16J15/10;H02M7/48;H05K7/20 主分类号 H02G3/08
代理机构 代理人
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