摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy adhesive excellent in both migration resistance and potting properties into detailed circuits, a metal-clad laminate, a coverlay, and a flexible printed circuit board. SOLUTION: The epoxy adhesive comprises a base resin containing an epoxy resin and a hardener, a carboxylated nitrile butadiene rubber, and a phenolic hydroxy group-containing aromatic polyamide-carboxylated nitrile butadiene rubber copolymer, wherein the compounding ratio of the carboxylated nitrile butadiene rubber to the phenolic hydroxy group-containing aromatic polyamide-carboxylated nitrile butadiene rubber copolymer is within 80:20 to 10:90. The sum of the additive amount of the carboxylated nitrile butadiene rubber and the phenolic hydroxy group-containing aromatic polyamide-carboxylated nitrile butadiene rubber copolymer is 10-100 pts.mass based on 100 pts.mass of the base resin. COPYRIGHT: (C)2006,JPO&NCIPI |