发明名称 EPOXY ADHESIVE, METAL-CLAD LAMINATE, COVERLAY, AND FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an epoxy adhesive excellent in both migration resistance and potting properties into detailed circuits, a metal-clad laminate, a coverlay, and a flexible printed circuit board. SOLUTION: The epoxy adhesive comprises a base resin containing an epoxy resin and a hardener, a carboxylated nitrile butadiene rubber, and a phenolic hydroxy group-containing aromatic polyamide-carboxylated nitrile butadiene rubber copolymer, wherein the compounding ratio of the carboxylated nitrile butadiene rubber to the phenolic hydroxy group-containing aromatic polyamide-carboxylated nitrile butadiene rubber copolymer is within 80:20 to 10:90. The sum of the additive amount of the carboxylated nitrile butadiene rubber and the phenolic hydroxy group-containing aromatic polyamide-carboxylated nitrile butadiene rubber copolymer is 10-100 pts.mass based on 100 pts.mass of the base resin. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006249218(A) 申请公布日期 2006.09.21
申请号 JP20050066877 申请日期 2005.03.10
申请人 FUJIKURA LTD 发明人 SENSO TOMOMITSU;NAKAMURA SHOICHIRO;SHINODA TATSUNORI
分类号 C09J163/00;B32B15/08;B32B15/092;C09J109/02;C09J177/00;H05K1/03 主分类号 C09J163/00
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