| 摘要 |
PROBLEM TO BE SOLVED: To provide a case-molding capacitor assured in excellent moisture-proof property by solving a problem that the moisture-proof property is rather unfavorable in the case-molding capacitor used for a mobile component or the like. SOLUTION: The case-molding type capacitor comprises a plurality of capacitor elements 1 connected with bus bars, and accommodates these capacitor elements in a case to form a resin mold. In this case-molding type capacitor, an inorganic filler is included in 63 to 80 wt% as the resin mold 6 and an epoxy resin including a circular type filler of 1% or more in this inorganic filler is used. Moreover, the moisture-proof property can be improved drastically by employing of a structure using a metal case 4 as the case. In addition, since bonding strength can be improved by remarkably improving wettability with the metal case 4, the peeling and crack of mold resin 6 are not generated even during thermal-shock inspection, and thereby not only the moisture-proof property but also higher reliability can be ensured. COPYRIGHT: (C)2006,JPO&NCIPI
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